Wafer Bonder | SUSS MicroTec
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SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets with 70 years of engineering ...
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晶圓接合系統
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全自動
ACS300Gen3
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半自動
AD12
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手動
MCS8
LabSpin6/LabSpin8
HP8
全自動
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JETx
手動
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全自動
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半自動
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手動
MJB4
全自動
DSM8/200Gen2
全自動
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半自動
BA8Gen4Pro
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全自動
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全自動
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晶圓接合系統
SUSSMicroTec將其在微結構與提供高標準性能和品質六十年的專業經驗運用至晶圓接合系統領域。
與研究機構和材料製造商的通力合作成就了尖端的智能方案。
這些設備廣泛用於2,5D和3D整合、製造和MEMS、LED以及功率半導體的封裝，並同是廣泛應用於相關的研發。
全自動
XBS200WaferBonderAutomatedPlatformforWaferSizesupto200mm
XBS200WaferBonderAutomatedPlatformforWaferSizesupto200mm
XBC300Gen2Debonder&CleanerAutomatedPlatformforWaferSizesupto300mm
XBC300Gen2Debonder&CleanerAutomatedPlatformforWaferSizesupto300mm
XBS300TemporaryBonderUniversalTemporaryWaferBonderforHighVolumeManufacturing
XBS300TemporaryBonderUniversalTemporaryWaferBonderforHighVolumeManufacturing
XBS300HybridBondingPlatformAutomatedPlatformforWaferSizesupto300mm
XBS300HybridBondingPlatformAutomatedPlatformforWaferSizesupto300mm
半自動
BAGen4SeriesBondAlignerManualBondAlignerWaferSizesupto8"/200mm
BAGen4SeriesBondAlignerManualBondAlignerWaferSizesupto8"/200mm
BA8Gen4ProBondAlignerHighPrecisionBondAligner
BA8Gen4ProBondAlignerHighPrecisionBondAligner
LD12DebonderSemi-AutomatedExcimerLaserDebonder
LD12DebonderSemi-AutomatedExcimerLaserDebonder
SB6/8Gen2WaferBonderSemi-automatedToolforPermanentWaferBondingofWafersupto8"/200mm
SB6/8Gen2WaferBonderSemi-automatedToolforPermanentWaferBondingofWafersupto8"/200mm
XB8WaferBonderUniversalHigh-ForceWaferBonder
XB8WaferBonderUniversalHigh-ForceWaferBonder
處理技術
Adhesive
Anodic
Eutectic
GlassFrit
混合式接合
MetalDiffusion
Slid
GeneralInformation
延伸文章資訊
- 1Suss MicroTec SB6L
- 2Wafer Bonder – The KNI Lab at Caltech
Wafer-Bonder Suss-SB6L.jpg ... Manufacturer, Suss Microtec ... The SB6L wafer bonder applies forc...
- 3Wafer Bonder | SUSS MicroTec - SÜSS MicroTec
SUSS MicroTec's wafer bonding platforms combine over seventy years of microstructuring experience...
- 4MANUAL WAFER BONDER - SUSS MicroTec - Yumpu
The SB6L wafer bonder is designed specifically for research,. development, and pre-production waf...
- 506,1014757 REV 01 CB6L Substrate Bonder User Manual
However, SUSS Microtec assumes no responsibility for any ... In no event will SUSS Microtec be .....
