Wafer Bonder | SUSS MicroTec - SÜSS MicroTec

SUSS MicroTec's wafer bonding platforms combine over seventy years of microstructuring experience with solid product quality and a broad range of ... Careers InvestorRelations News EN DE 中文 中文繁體 日本語 Products&Solutions CoaterandDeveloper InkjetPrinting Mask-Aligner Metrology WaferBonder PhotomaskEquipment ProjectionScanner ImprintLithography SUSSImprintExcellenceCenter Micro-Optics RemanufacturedEquipment CustomerService Training Automated ACS300Gen3 ACS300Gen2 ACS200Gen3 Semi-automated AD12 SD12 AS8/AS12 RCD8 Manual MCS8 LabSpin6/LabSpin8 HP8 Automated JETxSMSolderMask JETx Manual LP50 Automated MA300Gen2 MA200Gen3 MA100/150eGen2 Semi-automated MA12 MA8Gen5Mask-Aligner MA/BAGen4Series MA/BAGen4ProSeries Manual MJB4 Automated DSM8/200Gen2 Automated XBC300Gen2 XBS300 XBS300Hybrid-BonderPlattform XBS200 Semi-automated BA8Gen4Pro BAGen4Serie LD12 SB6/8Gen2 XB8 Automated MaskTrackProSeries ASxSerie Semi-automated HMxSerie Automated DSC300Gen3 Company Organization Research&Development QualityManagement Purchasing Events CustomerMagazine Contact Contact Locations CustomerService IRContact WaferBonder Automated Semi-Automated Technologies WaferBonder SUSSMicroTec’swaferbondingplatformscombineoverseventyyearsofmicrostructuringexperiencewithsolidproductqualityandabroadrangeofproductivityfeatures.Partneringwithresearch,academiaandmaterialsupplierswedevelopintelligentbondsolutionswhichofferleading-edgetechnologyforourcustomers.Ourwaferbondingplatformscovermanydifferentapplicationsin2.5Dand3Dintegration,MEMS,LEDandpowerdevicesaswellasotherareasofresearchanddevelopment. AutomatedWaferBonder XBS200WaferBonderAutomatedPlatformforWaferSizesupto200mm XBS200WaferBonderAutomatedPlatformforWaferSizesupto200mm XBC300Gen2Debonder&CleanerAutomatedPlatformforWaferSizesupto300mm XBC300Gen2Debonder&CleanerAutomatedPlatformforWaferSizesupto300mm XBS300TemporaryBonderUniversalTemporaryWaferBonderforHighVolumeManufacturing XBS300TemporaryBonderUniversalTemporaryWaferBonderforHighVolumeManufacturing XBS300HybridBondingPlatformAutomatedPlatformforWaferSizesupto300mm XBS300HybridBondingPlatformAutomatedPlatformforWaferSizesupto300mm Semi-AutomatedWaferBonder BAGen4SeriesBondAlignerManualBondAlignerWaferSizesupto8"/200mm BAGen4SeriesBondAlignerManualBondAlignerWaferSizesupto8"/200mm BA8Gen4ProBondAlignerHighPrecisionBondAligner BA8Gen4ProBondAlignerHighPrecisionBondAligner LD12DebonderSemi-AutomatedExcimerLaserDebonder LD12DebonderSemi-AutomatedExcimerLaserDebonder SB6/8Gen2WaferBonderSemi-automatedToolforPermanentWaferBondingofWafersupto8"/200mm SB6/8Gen2WaferBonderSemi-automatedToolforPermanentWaferBondingofWafersupto8"/200mm XB8WaferBonderUniversalHigh-ForceWaferBonder XB8WaferBonderUniversalHigh-ForceWaferBonder Technologies Adhesive Anodic Eutectic GlassFrit Hybrid MetalDiffusion Slid GeneralInformation