SB6/8 Gen2 Wafer Bonder - SÜSS MicroTec

With the SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes ... Careers InvestorRelations News EN DE 中文 中文繁體 日本語 Products&Solutions CoaterandDeveloper InkjetPrinting Mask-Aligner Metrology WaferBonder PhotomaskEquipment ProjectionScanner ImprintLithography SUSSImprintExcellenceCenter Micro-Optics RemanufacturedEquipment CustomerService Training Automated ACS300Gen3 ACS300Gen2 ACS200Gen3 Semi-automated AD12 SD12 AS8/AS12 RCD8 Manual MCS8 LabSpin6/LabSpin8 HP8 Automated JETxSMSolderMask JETx Manual LP50 Automated MA300Gen2 MA200Gen3 MA100/150eGen2 Semi-automated MA12 MA8Gen5Mask-Aligner MA/BAGen4Series MA/BAGen4ProSeries Manual MJB4 Automated DSM8/200Gen2 Automated XBC300Gen2 XBS300 XBS300Hybrid-BonderPlattform XBS200 Semi-automated BA8Gen4Pro BAGen4Serie LD12 SB6/8Gen2 XB8 Automated MaskTrackProSeries ASxSerie Semi-automated HMxSerie Automated DSC300Gen3 Company Organization Research&Development QualityManagement Purchasing Events CustomerMagazine Contact Contact Locations CustomerService IRContact SB6/8Gen2 Details Downloads Publications SB6/8Gen2WaferBonder UniversalSystemforWaferBonding WiththeSB6/8Gen2SUSSMicroTecprovidesasemi-automatedplatformformultiplebondingprocesses.Handlingwafersupto200mmaswellasvariousshapesandtypesofsubstratestheSB6/8Gen2presentsitselfasaflexibletoolforvariousapplicationsandprocessenvironments.TheSB6/8Gen2issuitableforpackagingaswellstructuringmeetingtherequirementsforMEMS,LED,advancedpackaging,2,5Dintegration,and3Dintegration. TheSB6/8Gen2permitsaneasyswitchfromR&Dtopilotproductionandfinallyvolumemanufacturing. Highlights VersatilityProcessstabilityHighthroughputcapabilityAconfigurablebondchamberofferswiderangesfortemperature,bondforces,andchamberpressureincreasingthenumberofpossibleapplicationsandallowingtheusertoadapttochangingprocessrequirements. IncombinationwiththeSUSSBondAlignersuite,theSB6/8Gen2offersahighlypreciseprebondalignment. Details WaferHandling ProcessParameter Details:BondingTechnologies TemporaryWaferBonding Adhesive Anodic Eutectic Fusion GlassFrit Downloads SB6/8Gen2DatasheetdownloadSUSSProductPortfoliodownload Publications Low-TemperatureHermeticSealBondingforWafer-LevelMEMSPackagingUsingSubmicronGoldParticleswithStencilPrintingPatterning